![]() ![]() ![]() Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB ![]() Note 1 Devices also available in 13 reel Use suffix e SCX Package Description (0 600 Wide) Molded Dual-In-Line (0 300 Wide) Molded Dual-In-Line (0 600 Wide) Ceramic Dual-In-Line (0 300 Wide) Ceramic Dual-In-Line (0 300 Wide) Molded Small Outline JEDEC 24-Lead Cerpack 24-Lead Ceramic Leadless Chip Carrier Type C The 'F676 contains 16 flip-flops with provision for synchronous parallel or serial entry and serial output When the Mode (M) input is HIGH information present on the parallel data P15) inputs is entered on the falling edge of the Clock Pulse (CP) input signal When M is LOW data is shifted out of the most significant bit position while information present on the Serial (SI) input shifts into the least significant bit position A HIGH signal on the Chip Select (CS) input prevents both parallel and serial operationsġ6-bit parallel-to-serial conversion 16-bit serial-in serial-out Chip select control Slim 24 lead 300 mil package
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